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RO3006 High-Frequency PCB
PCB Material:Rogers RO3006 / 0.71mm
MOQ:1PCS
Price:19.99-99 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:8-14 working days
Payment Method:T/T, Paypal
 

RO3006 High-Frequency PCB - 2-Layer 25mil Thick with ENIG Finish for RF/Microwave Applications


1.Introduction to RO3006 High-Frequency Laminate

Rogers RO3006 is a ceramic-filled PTFE composite designed for commercial microwave and RF applications. It provides exceptional dielectric constant (Dk) stability across temperatures, eliminating the Dk step change common in PTFE glass materials. Ideal for:
Automotive radar systems
5G wireless infrastructure
Satellite communications


2. Key Features

Dielectric Constant (Dk): 6.15 ± 0.15 @ 10 GHz/23°C
Dissipation Factor (Df): 0.002 @ 10 GHz
Thermal Stability: Td > 500°C
Thermal Conductivity: 0.79 W/mK
Moisture Absorption: 0.02%
CTE (Coefficient of Thermal Expansion):
X/Y-Axis: 17 ppm/°C (matches copper)
Z-Axis: 24 ppm/°C


3. Benefits

Stable Dk vs. Temperature/Frequency: Ensures reliable performance in RF circuits.
Low CTE (Matches Copper): Reduces thermal stress for SMT assemblies.
Cost-Effective Manufacturing: Suitable for high-volume production.



4. PCB Construction Details

SpecificationDetails
Base MaterialRogers RO3006 high-frequency laminate
Layer Count2 layers
Board Dimensions76mm × 52mm (1 piece)
Trace/Space5/4 mils minimum
Minimum Hole Size0.35mm
Blind ViasNo
Finished Thickness0.71mm
Copper Weight1 oz (35µm) outer layers
Via Plating Thickness20µm
Surface FinishElectroless Nickel Immersion Gold (ENIG)
Solder MaskGreen (top), None (bottom)
SilkscreenWhite (top), None (bottom)
Quality Assurance100% electrical testing before shipment

5. PCB Stackup (2-Layer Rigid PCB)

Layer 1: Copper (35µm)
Substrate: Rogers RO3006 (25mil / 0.635mm)
Layer 2: Copper (35µm)


6.PCB Statistics

Components: 12
Total Pads: 32 (14 thru-hole, 18 top SMT)
Vias: 21
Nets: 2


7.Manufacturing & Compliance

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Availability: Worldwide production and shipping


8.Target Applications

Automotive: Radar, ADAS sensors
Telecom: 5G base stations, power amplifiers
Aerospace: GPS antennas, satellite communications
High-Speed Digital: Backplanes, datalinks


 

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